EMK105BJ105KVHF [TAIYO YUDEN]
Capacitor, Ceramic, Chip, General Purpose, 1uF, 16V, ±10%, X5R, 0402 (1005 mm), 0.020"T, -55º ~ +85ºC, 7" Reel/2mm pitch;
| 型号： | EMK105BJ105KVHF |
| 厂家： | 
TAIYO YUDEN (U.S.A.), INC |
| 描述： | Capacitor, Ceramic, Chip, General Purpose, 1uF, 16V, ±10%, X5R, 0402 (1005 mm), 0.020"T, -55º ~ +85ºC, 7" Reel/2mm pitch 电容器 |
| 文件： | 总36页 (文件大小：880K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Notice for TAIYO YUDEN productsꢀ
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2013. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that TAIYO YUDEN CO., LTD. shall not be responsible for any defects in products or equipment incor-
porating such products, which are caused under the conditions other than those specified in this catalog or indi-
vidual specification.
■ Please contact TAIYO YUDEN CO., LTD. for further details of product specifications as the individual specification
is available.
■ Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
■ All electronic components listed in this catalogue are intended for use in general electronic equipment such as AV/
OA equipment, home electrical appliances, office equipment, and information-communication equipment (mobile
phone, PC, etc.), Medical equipment, Industrial equipment, and in automotive applications (for comfort). Please be
sure to contact TAIYO YUDEN CO., LTD. for further information before using the components for any equipment
which might have a negative impact directly on human life, such as transportation equipment (automotive pow-
ertrain/train/ship control systems, etc.) and traffic signal system.
Please do not incorporate the components into any equipment requiring a high degree of safety and reliability, such
as aerospace equipment, avionics, nuclear control equipment, submarine system, and military equipment.
For use in high safety and reliability-required devices/circuits of general electronic equipment, thorough safety
evaluation prior to use is strongly recommended, and a protective circuit should be designed and installed as nec-
essary.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called“TAIYO YUDEN’s official sales channel”).
It is only applicable to the products purchased from any of TAIYO YUDEN’s official sales channel.
■ Please note that TAIYO YUDEN CO., LTD. shall have no responsibility for any controversies or disputes that may
occur in connection with a third party's intellectual property rights and other related rights arising from your usage
of products in this catalog. TAIYO YUDEN CO., LTD. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to“Foreign Exchange and For-
eign Trade Control Law”of Japan,“U.S. Export Administration Regulations”, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
MULTILAYER CERAMIC CAPACITORS
REFLOW
■PARTS NUMBER
△＝Blank space
J
M
K
3
1
6
△
⑤
B
J
1
0
6
M
L
H
T
△
⑫
①
②
③
④
⑥
⑦
⑧
⑨
⑩
⑪
①Rated voltage
③End termination
Code
A
Rated voltage［VDC］
Code
K
End termination
4
Plated
J
6.3
10
R
High Reliability Application
L
④Dimension（L×W）
Type
E
16
Dimensions
T
25
EIA（inch）
（L×W）［mm］
1.0 × 0.5
G
35
0402
0204
0603
0306
0805
0508
1206
1210
1812
U
50
105
107
212
0.52× 1.0
1.6 × 0.8
0.8 × 1.6
2.0 × 1.25
1.25× 2.0
3.2 × 1.6
3.2 × 2.5
4.5 × 3.2
※
H
100
250
630
Q
S
※
※
②Series name
316
325
432
Code
M
Series name
Multilayer ceramic capacitor
LW reverse type multilayer capacitor
W
Note : ※LW reverse type（□WK） only
⑤Dimension tolerance
Code
△
Type
ALL
105
L［mm］
Standard
W［mm］
T［mm］
Standard
Standard
1.0±0.10
0.5±0.10
0.5±0.10
107
1.6＋0.15/－0.05
0.8＋0.15/－0.05
0.8＋0.15/－0.05
0.85±0.10
A
212
2.0＋0.15/－0.05
1.25＋0.15/－0.05
1.25＋0.15/－0.05
1.6±0.20
316
325
105
107
3.2±0.20
1.6±0.20
3.2±0.30
2.5±0.30
2.5±0.30
1.0＋0.15/－0.05
1.6＋0.20/－0
0.5＋0.15/－0.05
0.8＋0.20/－0
0.5＋0.15/－0.05
0.8＋0.20/－0
0.85±0.10
B
C
212
2.0＋0.20/－0
1.25＋0.20/－0
1.25＋0.20/－0
1.6±0.30
316
105
3.2±0.30
1.6±0.30
1.0＋0.20/－0
0.5＋0.20/－0
0.5＋0.20/－0
Note: P.17 Standard external dimensions
△= Blank space
⑥Temperature characteristics code
■High dielectric type
Applicable
Temperature
Ref. Temp.［℃］
range［℃］
Capacitance
tolerance
±10％
Tolerance
Code
Capacitance change
±15％
standard
code
K
BJ
B7
C6
C7
EIA
EIA
EIA
EIA
X5R
X7R
X6S
X7S
－55～＋ 85
－55～＋125
－55～＋105
－55～＋125
25
25
25
25
±20％
M
±10％
K
±15％
±20％
M
±10％
K
±22％
±20％
M
±10％
K
±22％
±20％
M
■Temperature compensating type
Applicable
Temperature
range［℃］
Capacitance
tolerance
±0.1pF
±0.25pF
±0.5pF
±1pF
Tolerance
Code
Ref. Temp.［℃］
20
Capacitance change
0±30ppm/℃
standard
code
B
JIS
EIA
CG
C
D
CG
－55～＋125
F
C0G
25
±5％
J
±10％
K
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
16
⑦Nominal capacitance
⑨Thickness
Code
Code
V
Thickness［mm］
Nominal capacitance
（example）
0.5
0R5
0.5pF
1pF
A
0.8
010
D
0.85(212type or more)
100
10pF
F
1.15
1.25
1.5
101
100pF
1,000pF
10,000pF
0.1μF
1.0μF
10μF
100μF
G
102
H
103
L
1.6
104
N
1.9
105
M
2.5
106
107
⑩Special code
Note : R＝Decimal point
Code
－
Special code
⑧Capacitance tolerance
H
MLCC for Industrial, Automotive Comfort
and Safety
Code
B
Capacitance tolerance
±0.1pF
C
±0.25pF
±0.5pF
⑪Packaging
D
Code
Packaging
J
±5％
F
T
φ178mm Taping （2mm pitch）
φ178mm Taping （4mm pitch）
φ178mm Taping （4mm pitch, 1000 pcs/reel）
325 type（Thickness code M）
K
±10％
M
±20％
P
⑫Internal code
Code
△
Internal code
Standard
■STANDARD EXTERNAL DIMENSIONS
Dimension [mm]
Type( EIA )
Ｌ
Ｗ
T
*1
V
P
e
□MK105（0402）
□WK105（0204）※
□MK107（0603）
□MR107（0603）
□WK107（0306）※
1.0±0.05
0.52±0.05
1.6±0.10
1.6±0.10
0.8±0.10
0.5±0.05
1.0±0.05
0.8±0.10
0.8±0.10
1.6±0.10
0.5±0.05
0.3±0.05
0.8±0.10
0.8±0.10
0.5±0.05
0.85±0.10
1.25±0.10
1.25±0.10
0.85±0.1
1.15±0.10
1.6±0.20
1.6±0.20
1.15±0.10
1.5±0.10
1.9±0.20
2.5±0.20
1.9±0.20
2.5±0.20
2.5±0.20
0.25±0.10
0.18±0.08
0.35±0.25
0.1～0.6
A
Ａ
Ｖ
D
G
Ｇ
Ｄ
Ｆ
L
0.25±0.15
□MK212（0805）
2.0±0.10
1.25±0.10
0.5±0.25
□MR212（0805）
2.0±0.10
1.25±0.10
2.0±0.15
0.25～0.75
0.3±0.2
□WK212（0508）※
1.25±0.15
□MK316（1206）
□MR316（1206）
3.2±0.15
3.2±0.15
1.6±0.15
1.6±0.15
0.5＋0.35/－0.25
0.25～0.85
L
F
e
H
N
M
N
M
M
□MK325（1210）
3.2±0.30
2.5±0.20
0.6±0.3
※ LW reverse type
□MR325（1210）
□MK432（1812）
3.2±0.30
4.5±0.40
2.5±0.20
3.2±0.30
0.3～0.9
0.9±0.6
Note : ※. LW reverse type, *1.Thickness code
■STANDARD QUANTITY
Dimension
Standard quantity［pcs］
Type
105
EIA（inch）
0402
［ｍｍ］
0.5
Code
V
Paper tape
Embossed tape
10000
－
0204 ※
0603
0.30
0.8
P
A
4000
－
－
4000
－
107
0306 ※
0.50
0.85
1.25
0.85
1.15
1.6
V
D
4000
－
0805
212
316
G
D
3000
－
0508 ※
1206
4000
－
F
3000
2000
L
－
1.15
1.5
F
H
－
2000
325
432
1210
1812
1.9
N
2.5
M
M
－
－
500（T），1000（P）
500
2.5
Note : ※.LW Reverse type（□WK）
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
17
■PARTS NUMBER
・ All the Multilayer Ceramic Capacitors of Catalog Lineup are Compliance RoHS.
・ Capacitance tolerance code is applied to [] of part number.
Note)
*1 We may provide X7R/X7S for some items according to the individual specification.
*2 The exchange of individual specification is necessary depending on the application and circuit condition. Please contact TAIYO YUDEN sales channels.
*3 The size standard should look at ④Dimension, ⑤Dimension tolerance, and ⑨Thickness, and P.17 Standard external dimensions.
Multilayer Ceramic Capacitors (High dielectric type)
●105TYPE
【Temperature Characteristic BJ : X5R】ꢀ0.5mm thickness（V）
Soldering
R:Reflow
W:Wave
R
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
UMK105 BJ102[]VHF
UMK105 BJ152[]VHF
UMK105 BJ222[]VHF
UMK105 BJ332[]VHF
UMK105 BJ472[]VHF
UMK105 BJ682[]VHF
UMK105 BJ103[]VHF
UMK105 BJ104[]VHF
TMK105 BJ472[]VHF
TMK105 BJ682[]VHF
TMK105 BJ103[]VHF
TMK105 BJ223[]VHF
TMK105 BJ473[]VHF
TMK105 BJ104[]VHF
ＴMK105 BJ224[]VHF
ＴMK105ABJ474[]VHF
EMK105 BJ223[]VHF
EMK105 BJ473[]VHF
EMK105 BJ104[]VHF
EMK105 BJ224[]VHF
EMK105ABJ474[]VHF
EMK105 BJ105[]VHF
LMK105 BJ224[]VHF
LMK105ABJ474[]VHF
LMK105 BJ105[]VHF
LMK105ABJ225MVHF
JMK105 BJ224[]VHF
JMK105 BJ474[]VHF
JMK105 BJ105[]VHF
JMK105 BJ225MVHF
JMK105BBJ475MVHF
AMK105 BJ225MVHF
AMK105BBJ475MVHF
AMK105CBJ106MVHF
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
1000 p
1500 p
2200 p
3300 p
4700 p
6800 p
10000 p
0.1 μ
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±20
2.5
2.5
2.5
2.5
2.5
2.5
3.5
10
2.5
2.5
3.5
3.5
3.5
5
200
200
200
200
200
150
200
150
200
200
200
200
150
150
150
150
200
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.10
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.10
0.5±0.05
0.5±0.05
0.5±0.10
0.5±0.05
0.5±0.10
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5+0.15/-0.05
0.5±0.05
0.5+0.15/-0.05
0.5+0.20/-0
R
R
R
50
R
R
R
R
4700 p
6800 p
10000 p
0.022 μ
0.047 μ
0.1 μ
R
R
R
R
25
R
R
0.22 μ
0.47 μ
0.022 μ
0.047 μ
0.1 μ
10
10
3.5
3.5
5
R
R
R
R
R
16
10
0.22 μ
0.47 μ
1 μ
10
10
10
10
10
10
10
5
R
R
R
0.22 μ
0.47 μ
1 μ
R
R
R
2.2 μ
R
0.22 μ
0.47 μ
1 μ
±10，±20
±10，±20
±10，±20
±20
R
10
10
10
10
10
10
10
R
6.3
4
R
2.2 μ
R
4.7 μ
±20
R
2.2 μ
±20
R
4.7 μ
±20
R
10 μ
±20
R
【Temperature Characteristic B7 : X7R】ꢀ0.5mm thickness（V）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
UMK105 B7102[]VHF
UMK105 B7152[]VHF
UMK105 B7222[]VHF
UMK105 B7332[]VHF
UMK105 B7472[]VHF
UMK105 B7682[]VHF
UMK105 B7103[]VHF
TMK105 B7472[]VHF
TMK105 B7682[]VHF
TMK105 B7103[]VHF
TMK105 B7104[]VHF
EMK105 B7223[]VHF
EMK105 B7473[]VHF
EMK105 B7104[]VHF
EMK105 B7224[]VHF
LMK105 B7104[]VHF
LMK105 B7224[]VHF
JMK105 B7224[]VHF
JMK105 B7474[]VHF
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
1000 p
1500 p
2200 p
3300 p
4700 p
6800 p
10000 p
4700 p
6800 p
10000 p
0.1 μ
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
2.5
2.5
2.5
2.5
2.5
2.5
3.5
2.5
2.5
3.5
10
200
200
200
200
150
150
150
200
200
200
150
150
150
150
150
150
150
150
150
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
50
25
16
0.022 μ
0.047 μ
0.1 μ
3.5
3.5
10
0.22 μ
0.1 μ
10
10
10
0.22 μ
0.22 μ
0.47 μ
10
10
6.3
10
●107TYPE
【Temperature Characteristic BJ : X5R】ꢀ0.8mm thickness（A）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
UMK107 BJ104[]AHT
UMK107 BJ224[]AHT
UMK107 BJ474[]AHT
UMK107ABJ105[]AHT
GMK107 BJ223[]AHT
GMK107 BJ473[]AHT
GMK107 BJ104[]AHT
GMK107 BJ224[]AHT
GMK107ABJ474[]AHT
GMK107 BJ105[]AHT
TMK107 BJ223[]AHT
TMK107 BJ473[]AHT
TMK107 BJ104[]AHT
TMK107 BJ224[]AHT
TMK107 BJ474[]AHT
TMK107 BJ105[]AHT
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
0.1 μ
0.22 μ
0.47 μ
1 μ
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
3.5
10
10
10
2.5
3.5
3.5
10
10
10
2.5
3.5
3.5
5
150
150
150
150
200
200
150
150
150
150
200
200
150
150
150
150
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8+0.15/-0.05
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
50
0.022 μ
0.047 μ
0.1 μ
35
25
0.22 μ
0.47 μ
1 μ
0.022 μ
0.047 μ
0.1 μ
0.22 μ
0.47 μ
1 μ
3.5
10
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
18
■PARTS NUMBER
Part number 1
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 2
Rated voltage [V]
Rated voltage x ％
EMK107 BJ104[]AHT
EMK107 BJ224[]AHT
EMK107 BJ474[]AHT
EMK107 BJ105[]AHT
EMK107ABJ225[]AHT
LMK107 BJ474[]AHT
LMK107 BJ105[]AHT
LMK107 BJ225[]AHT
LMK107 BJ475[]AHT
LMK107BBJ106MAHT
JMK107 BJ225[]AHT
JMK107 BJ475[]AHT
JMK107ABJ106MAHT
AMK107ABJ106MAHT
AMK107BBJ226MAHT
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
0.1 μ
0.22 μ
0.47 μ
1 μ
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±20
3.5
5
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
0.8±0.10
0.8±0.10
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
16
3.5
5
0.8±0.10
0.8±0.10
2.2 μ
0.47 μ
1 μ
10
3.5
5
0.8+0.15/-0.05
0.8±0.10
0.8±0.10
10
2.2 μ
4.7 μ
10 μ
2.2 μ
4.7 μ
10 μ
10 μ
22 μ
10
10
10
10
10
10
10
10
0.8±0.10
0.8±0.10
0.8+0.20/-0
0.8±0.10
±10，±20
±10，±20
±20
6.3
4
0.8±0.10
0.8+0.15/-0.05
0.8+0.15/-0.05
0.8+0.20/-0
±20
±20
【Temperature Characteristic B7 : X7R , C7 : X7S】ꢀ0.8mm thickness（A）
Soldering
R:Reflow
W:Wave
R
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
UMK107 B7102[]AHT
UMK107 B7152[]AHT
UMK107 B7222[]AHT
UMK107 B7332[]AHT
UMK107 B7472[]AHT
UMK107 B7682[]AHT
UMK107 B7103[]AHT
UMK107 B7223[]AHT
UMK107 B7473[]AHT
UMK107 B7104[]AHT
GMK107 B7473[]AHT
GMK107 B7104[]AHT
GMK107 B7224[]AHT
GMK107 B7474[]AHT
GMK107AB7105[]AHT
TMK107 B7223[]AHT
TMK107 B7473[]AHT
TMK107 B7104[]AHT
TMK107 B7224[]AHT
TMK107 B7474[]AHT
TMK107AB7105[]AHT
EMK107 B7473[]AHT
EMK107 B7104[]AHT
EMK107 B7224[]AHT
EMK107 B7474[]AHT
EMK107 B7105[]AHT
LMK107 B7224[]AHT
LMK107 B7474[]AHT
LMK107 B7105[]AHT
JMK107 C7225[]AHT
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7S
1000 p
1500 p
2200 p
3300 p
4700 p
6800 p
10000 p
0.22 p
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
10
10
10
2.5
3.5
3.5
10
10
10
3.5
3.5
5
200
200
200
200
200
200
200
200
200
200
200
150
150
150
150
200
200
150
150
150
150
200
150
150
150
150
150
150
150
150
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8+0.15/-0.05
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8+0.15/-0.05
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
R
R
R
R
50
R
R
R
0.47 p
R
0.1 μ
R
0.047 μ
0.1 μ
R
R
35
25
16
0.22 μ
0.47 μ
1 μ
R
R
R
0.022 μ
0.047 μ
0.1 μ
R
R
R
0.22 μ
0.47 μ
1 μ
R
R
R
0.047 μ
0.1 μ
R
R
0.22 μ
0.47 μ
1 μ
R
10
10
5
R
R
0.22 μ
0.47 μ
1 μ
R
10
3.5
5
R
R
6.3
2.2 μ
10
R
●212TYPE
【Temperature Characteristic BJ : X5R】ꢀ1.25mm thickness（G）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
UMK212 BJ104[]GHT
UMK212 BJ224[]GHT
UMK212 BJ474[]GHT
UMK212 BJ105[]GHT
GMK212 BJ104[]GHT
GMK212 BJ224[]GHT
GMK212 BJ474[]GHT
GMK212 BJ105[]GHT
TMK212 BJ104[]GHT
TMK212 BJ224[]GHT
TMK212 BJ474[]GHT
TMK212 BJ105[]GHT
TMK212 BJ225[]GHT
TMK212BBJ475[]GHT
EMK212 BJ105[]GHT
EMK212 BJ225[]GHT
EMK212ABJ475[]GHT
EMK212BBJ106[]GHT
LMK212 BJ225[]GHT
LMK212ABJ475[]GHT
LMK212ABJ106[]GHT
JMK212ABJ475[]GHT
JMK212ABJ106[]GHT
JMK212BBJ226MGHT
AMK212ABJ226MGHT
AMK212BBJ476MGHT
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
0.1 μ
0.22 μ
0.47 μ
1 μ
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±20
3.5
3.5
3.5
5
200
150
150
150
200
150
150
150
200
150
200
150
150
150
150
200
150
150
200
150
150
200
150
150
150
150
1.25±0.10
1.25±0.10
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
50
1.25±0.10
1.25±0.10
0.1 μ
0.22 μ
0.47 μ
1 μ
3.5
3.5
3.5
5
1.25±0.10
1.25±0.10
35
25
1.25±0.10
1.25±0.10
0.1 μ
0.22 μ
0.47 μ
1 μ
3.5
3.5
3.5
3.5
5
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
2.2 μ
4.7 μ
1 μ
1.25±0.10
10
3.5
5
1.25+0.20/-0
1.25±0.10
2.2 μ
4.7 μ
10 μ
2.2 μ
4.7 μ
10 μ
4.7 μ
10 μ
22 μ
22 μ
47 μ
1.25±0.10
16
10
10
10
5
1.25+0.15/-0.05
1.25+0.20/-0
1.25±0.10
10
10
5
1.25+0.15/-0.05
1.25+0.15/-0.05
1.25+0.15/-0.05
1.25+0.15/-0.05
1.25+0.20/-0
1.25+0.15/-0.05
1.25+0.20/-0
6.3
4
10
10
10
10
±20
±20
【Temperature Characteristic BJ : X5R】ꢀ0.85mm thickness（D）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
16
Rated voltage x ％
EMK212 BJ105[]DHT
EMK212ABJ225[]DHT
EMK212BBJ475[]DHT
X5R
X5R
X5R
1 μ
2.2 μ
4.7 μ
±10，±20
±10，±20
±10，±20
5
5
200
150
150
0.85±0.10
0.85±0.10
0.85±0.10
R
R
R
10
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
19
■PARTS NUMBER
【Temperature Characteristic B7 : X7R】ꢀ1.25mm thickness（G）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
UMK212 B7103[]GHT
UMK212 B7223[]GHT
UMK212 B7473[]GHT
UMK212 B7104[]GHT
UMK212 B7224[]GHT
GMK212 B7224[]GHT
GMK212 B7105[]GHT
TMK212 B7224[]GHT
TMK212 B7474[]GHT
TMK212 B7105[]GHT
TMK212 B7225[]GHT
EMK212 B7224[]GHT
EMK212 B7474[]GHT
EMK212 B7105[]GHT
EMK212 B7225[]GHT
EMK212AB7475[]GHT
LMK212 B7105[]GHT
LMK212 B7225[]GHT
LMK212 B7475[]GHT
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
10000 p
0.022 μ
0.047 μ
0.1 μ
0.22 μ
0.22 μ
1 μ
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
3.5
3.5
3.5
3.5
3.5
3.5
5
200
200
200
200
150
150
150
150
150
150
150
150
150
150
150
150
150
150
150
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25+0.15/-0.05
1.25±0.10
1.25±0.10
1.25±0.10
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
50
35
25
0.22 μ
0.47 μ
1 μ
3.5
3.5
3.5
10
3.5
3.5
3.5
10
10
3.5
10
10
2.2 μ
0.22 μ
0.47 μ
1 μ
16
10
2.2 μ
4.7 μ
1 μ
2.2 μ
4.7 μ
●316TYPE
【Temperature Characteristic BJ : X5R】ꢀ1.6mm thickness（L）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
UMK316 BJ474[]LHT
UMK316 BJ105[]LHT
UMK316 BJ225[]LHT
UMK316ABJ475[]LHT
GMK316 BJ105[]LHT
GMK316 BJ225[]LHT
GMK316 BJ475[]LHT
TMK316 BJ225[]LHT
TMK316 BJ475[]LHT
TMK316 BJ106[]LHT
EMK316 BJ225[]LHT
EMK316 BJ475[]LHT
EMK316 BJ106[]LHT
EMK316BBJ226MLHT
LMK316 BJ475[]LHT
LMK316 BJ106[]LHT
LMK316ABJ226[]ＬHT
JMK316 BJ106[]LHT
JMK316ABJ226[]LHT
JMK316ABJ476MLHT
JMK316BBJ107MLHT
AMK316ABJ107MLHT
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
0.47 μ
1 μ
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±20
3.5
3.5
10
10
3.5
10
10
3.5
5
200
200
150
150
200
150
150
200
150
150
200
150
150
150
150
150
150
200
150
150
150
150
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.30
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.30
1.6±0.20
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
50
2.2 μ
4.7 μ
1 μ
35
25
2.2 μ
4.7 μ
2.2 μ
4.7 μ
10 μ
2.2 μ
4.7 μ
10 μ
22 μ
4.7 μ
10 μ
22 μ
10 μ
22 μ
47 μ
100 μ
100 μ
5
3.5
5
16
10
5
10
5
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±20
5
10
5
10
10
10
10
6.3
4
±20
±20
【Temperature Characteristic B7 : X7R】ꢀ1.6mm thickness（L）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
UMK316 B7473[]LHT
UMK316 B7104[]LHT
UMK316 B7224[]LHT
UMK316 B7474[]LHT
UMK316 B7105[]LHT
UMK316 B7225[]LHT
GMK316 B7105[]LHT
GMK316 B7225[]LHT
GMK316AB7475[]LHT
TMK316 B7225[]LHT
TMK316AB7475[]LHT
TMK316AB7106[]LHT
EMK316 B7225[]LHT
EMK316AB7475[]LHT
EMK316AB7106[]LHT
LMK316 B7475[]LHT
LMK316AB7106[]LHT
JMK316AB7106[]LHT
JMK316AB7226[]LHT
AMK316AB7226[]LHT
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
0.047 μ
0.1 μ
0.22 μ
0.47 μ
1 μ
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
3.5
3.5
3.5
3.5
3.5
10
3.5
10
10
3.5
10
10
3.5
10
10
5
200
200
200
200
200
150
200
150
150
200
150
150
200
150
150
150
150
150
150
150
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
50
2.2 μ
1 μ
35
25
2.2 μ
4.7 μ
2.2 μ
4.7 μ
10 μ
2.2 μ
4.7 μ
10 μ
4.7 μ
10 μ
10 μ
22 μ
22 μ
16
10
10
10
10
10
6.3
4
●325TYPE
【Temperature Characteristic BJ : X5R】ꢀ2.5mm thickness（M）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
UMK325 BJ106[]MHT
GMK325 BJ106[]MHT
TMK325 BJ106[]MHT
EMK325 BJ226[]MHT
LMK325 BJ226[]MHT
LMK325 BJ476MMHT
LMK325ABJ107MMHT
JMK325 BJ476MMHT
JMK325ABJ107MMHT
AMK325ABJ107MMHT
AMK325ABJ227MMHT
50
35
25
16
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
X5R
10 μ
10 μ
10 μ
22 μ
22 μ
47 μ
100 μ
47 μ
100 μ
100 μ
220 μ
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±20
5
5
150
150
150
150
150
150
150
150
150
150
150
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.30
2.5±0.20
2.5±0.30
2.5±0.30
2.5±0.30
R
R
R
R
R
R
R
R
R
R
R
5
5
5
10
10
10
10
10
10
10
±20
±20
6.3
4
±20
±20
±20
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
20
■PARTS NUMBER
【Temperature Characteristic BJ : X5R】ꢀ1.9mm thickness（N）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
UMK325 BJ475[]NHT
GMK325 BJ225MNHT
GMK325 BJ475[]NHT
TMK325 BJ475[]NHT
EMK325 BJ475MNHT
EMK325 BJ106[]NHT
50
35
25
16
X5R
X5R
X5R
X5R
X5R
X5R
4.7 μ
2.2 μ
4.7 μ
4.7 μ
4.7 μ
10 μ
±10，±20
±20
10
3.5
10
10
3.5
5
150
200
150
150
200
150
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
R
R
R
R
R
R
±10，±20
±10，±20
±20
±10，±20
【Temperature Characteristic BJ : X5R】ꢀ1.5mm thickness（H）
Soldering
R:Reflow
W:Wave
R
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
UMK325 BJ105MHHT
TMK325 BJ225MHHT
50
25
X5R
X5R
1 μ
±20
±20
3.5
3.5
200
200
1.5±0.１0
1.5±0.１0
2.2 μ
R
【Temperature Characteristic C6 : X6S】ꢀ2.5mm thickness（M）
Soldering
R:Reflow
W:Wave
R
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
2.5±0.30
Part number 1
Part number 2
Rated voltage [V]
6.3
Rated voltage x ％
150
JMK325AC6107MMHT
X6S
100 μ
±20
10
【Temperature Characteristic B7 : X7R , C7 : X7S】ꢀ2.5mm thickness（M）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
UMK325 B7475[]MHT
UMK325AC7106MMHT
GMK325 C7106[]MHT
TMK325AB7106[]MHTR
EMK325 B7226[]MHT
LMK325 C7226MMHT
JMK325 B7226[]MHTR
JMK325 B7476[]MHTR
X7R
X7S
X7S
X7R
X7R
X7S
X7R
X7R
4.7 μ
10 μ
10 μ
10 μ
22 μ
22 μ
22 μ
47 μ
±10，±20
±20
5
150
150
150
150
150
150
150
150
2.5±0.20
2.5±0.30
2.5±0.30
2.5±0.30
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
R
R
R
R
R
R
R
R
50
10
5
35
25
16
10
±10，±20
±10，±20
±10，±20
±20
10
10
5
±10，±20
±10，±20
10
10
6.3
【Temperature Characteristic B7 : X7R】ꢀ1.9mm thickness（N）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
GMK325 B7225[]NHT
GMK325 B7475MNHTR
TMK325 B7475[]NHT
EMK325 B7106[]NHT
X7R
X7R
X7R
X7R
2.2 μ
4.7 μ
4.7 μ
10 μ
±10，±20
±20
3.5
10
10
5
200
150
150
150
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
R
R
R
R
35
25
16
±10，±20
±10，±20
【Temperature Characteristic B7 : X7R】ꢀ1.5mm thickness（H）
Soldering
R:Reflow
W:Wave
R
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
1.5±0.１0
Part number 1
Part number 2
Rated voltage [V]
50
Rated voltage x ％
200
UMK325 B7105[]HHT
X7R
1 μ
±10，±20
3.5
Multilayer Ceramic Capacitors （Temperature compensating type）
●105TYPE
【Temperature Characteristic CG : CG/C0G】ꢀ0.5mm thickness（V）
Soldering
R:Reflow
W:Wave
R
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Q
Rated voltage x ％
UMK105 CG0R5CVHF
UMK105 CG010CVHF
UMK105 CG1R5CVHF
UMK105 CG020CVHF
UMK105 CG030CVHF
UMK105 CG040CVHF
UMK105 CG050CVHF
UMK105 CG060DVHF
UMK105 CG070DVHF
UMK105 CG080DVHF
UMK105 CG090DVHF
UMK105 CG100DVHF
UMK105 CG120JVHF
UMK105 CG150JVHF
UMK105 CG180JVHF
UMK105 CG220JVHF
UMK105 CG270JVHF
UMK105 CG330JVHF
UMK105 CG390JVHF
UMK105 CG470JVHF
UMK105 CG560JVHF
UMK105 CG680JVHF
UMK105 CG820JVHF
UMK105 CG101JVHF
UMK105 CG121JVHF
UMK105 CG151JVHF
UMK105 CG181JVHF
UMK105 CG221JVHF
UMK105 CG271JVHF
UMK105 CG331JVHF
UMK105 CG361JVHF
UMK105 CG391JVHF
UMK105 CG431JVHF
UMK105 CG471JVHF
UMK105 CG511JVHF
UMK105 CG561JVHF
UMK105 CG621JVHF
UMK105 CG681JVHF
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
CG
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
C0G
0.5 p
1 p
±0.25pF
±0.25pF
±0.25pF
±0.25pF
±0.25pF
±0.25pF
±0.25pF
±0.5pF
±0.5pF
±0.5pF
±0.5pF
±0.5pF
±5％
410
420
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
R
1.5 p
2 p
430
R
440
R
3 p
460
R
4 p
480
R
5 p
500
R
6 p
520
R
7 p
540
R
8 p
560
R
9 p
580
R
10 p
12 p
15 p
18 p
22 p
27 p
33 p
39 p
47 p
56 p
68 p
82 p
100 p
120 p
150 p
180 p
220 p
270 p
330 p
360 p
390 p
430 p
470 p
510 p
560 p
620 p
680 p
600
R
640
R
±5％
700
R
±5％
760
R
±5％
840
R
±5％
940
R
±5％
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
R
±5％
R
50
±5％
R
±5％
R
±5％
R
±5％
R
±5％
R
±5％
R
±5％
R
±5％
R
±5％
R
±5％
R
±5％
R
±5％
R
±5％
R
±5％
R
±5％
R
±5％
R
±5％
R
±5％
R
±5％
R
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
21
■PARTS NUMBER
Part number 1
Soldering
R:Reflow
W:Wave
R
R
R
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
Thickness*3 [mm]
Part number 2
Rated voltage [V]
50
Q
Rated voltage x ％
UMK105 CG751JVHF
UMK105 CG821JVHF
UMK105 CG102JVHF
CG
CG
CG
C0G
C0G
C0G
750 p
820 p
±5％
±5％
±5％
1000
1000
1000
200
200
200
0.5±0.05
0.5±0.05
0.5±0.05
1000 p
Medium-High Voltage Multilayer Ceramic Capacitors
●107TYPE
【Temperature Characteristic B7 : X7R】ꢀ0.8mm thickness（A）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
HMK107 B7102[]AHT
HMK107 B7152[]AHT
HMK107 B7222[]AHT
HMK107 B7332[]AHT
HMK107 B7472[]AHT
HMK107 B7682[]AHT
HMK107 B7103[]AHT
HMK107 B7153[]AHT
HMK107 B7223[]AHT
HMK107 B7333[]AHT
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
1000 p
1500 p
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
200
200
200
200
200
200
200
200
200
200
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
R
R
R
R
R
R
R
R
R
R
2200 p
3300 p
4700 p
100
6800 p
10000 p
0.015 μ
0.022 μ
0.033 μ
●212TYPE
【Temperature Characteristic B7 : X7R】ꢀ1.25mm thickness（G）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
HMK212 B7103[]GHT
HMK212 B7153[]GHT
HMK212 B7223[]GHT
HMK212 B7333[]GHT
HMK212 B7473[]GHT
HMK212 B7683[]GHT
HMK212 B7104[]GHT
HMK212 B7224[]GHT
QMK212 B7472[]GHT
QMK212 B7682[]GHT
QMK212 B7103[]GHT
QMK212 B7153[]GHT
QMK212 B7223[]GHT
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
10000 p
0.015 μ
0.022 μ
0.033 μ
0.047 μ
0.068 μ
0.1 μ
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
200
200
200
200
200
200
200
200
150
150
150
150
150
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
R
R
R
R
R
R
R
R
R
R
R
R
R
100
0.22 μ
4700 p
6800 p
250
10000 p
0.015 μ
0.022 μ
【Temperature Characteristic B7 : X7R】ꢀ0.85mm thickness（D）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
QMK212 B7102[]DHT
QMK212 B7152[]DHT
QMK212 B7222[]DHT
QMK212 B7332[]DHT
X7R
X7R
X7R
X7R
1000 p
1500 p
2200 p
3300 p
±10，±20
±10，±20
±10，±20
±10，±20
2.5
2.5
2.5
2.5
150
150
150
150
0.85±0.10
0.85±0.10
0.85±0.10
0.85±0.10
R
R
R
R
250
●316TYPE
【Temperature Characteristic B7 : X7R】ꢀ1.6mm thickness（L）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
HMK316 B7473[]LHT
HMK316 B7104[]LHT
HMK316 B7154[]LHT
HMK316 B7224[]LHT
HMK316 B7334[]LHT
HMK316 B7474[]LHT
HMK316 B7105[]LHT
QMK316 B7333[]LHT
QMK316 B7473[]LHT
QMK316 B7683[]LHT
QMK316 B7104[]LHT
SMK316 B7153[]LHT
SMK316 B7223[]LHT
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
0.047 μ
0.1 μ
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
3.5
3.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
200
200
200
200
200
200
200
150
150
150
150
120
120
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
R
R
R
R
R
R
R
R
R
R
R
R
R
0.15 μ
0.22 μ
0.33 μ
0.47 μ
1 μ
100
0.033 μ
0.047 μ
0.068 μ
0.1 μ
250
630
0.015 μ
0.022 μ
【Temperature Characteristic B7 : X7R】ꢀ1.15mm thickness（F）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
SMK316 B7102[]FHT
SMK316 B7152[]FHT
SMK316 B7222[]FHT
SMK316 B7332[]FHT
SMK316 B7472[]FHT
SMK316 B7682[]FHT
SMK316 B7103[]FHT
X7R
X7R
X7R
X7R
X7R
X7R
X7R
1000 p
1500 p
2200 p
3300 p
4700 p
6800 p
10000 p
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
2.5
2.5
2.5
2.5
2.5
2.5
2.5
120
120
120
120
120
120
120
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
1.15±0.10
R
R
R
R
R
R
R
630
●325TYPE
【Temperature Characteristic B7 : X7R】ꢀ2.5mm thickness（M）
Soldering
R:Reflow
W:Wave
R
Rated voltage [V]
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
2.5±0.20
Part number 1
Part number 2
Rated voltage x ％
200
HMK325 B7225[]MHT
100
X7R
2.2 μ
±10，±20
3.5
【Temperature Characteristic B7 : X7R】ꢀ1.9mm thickness（N）
Soldering
R:Reflow
W:Wave
R
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
100
Rated voltage x ％
HMK325 B7224[]NHT
HMK325 B7474[]NHT
X7R
X7R
0.22 μ
0.47 μ
±10，±20
±10，±20
3.5
3.5
200
200
1.9±0.20
1.9±0.20
R
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
22
■PARTS NUMBER
Part number 1
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 2
Rated voltage [V]
100
Rated voltage x ％
HMK325 B7684[]NHT
HMK325 B7105[]NHT
QMK325 B7473[]NHT
QMK325 B7104[]NHT
QMK325 B7154[]NHT
QMK325 B7224[]NHT
SMK325 B7223[]NHT
SMK325 B7333[]NHT
SMK325 B7473[]NHT
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
0.68 μ
1 μ
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
200
200
150
150
150
150
120
120
120
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
R
R
R
R
R
R
R
R
R
0.047 μ
0.1 μ
250
630
0.15 μ
0.22 μ
0.022 μ
0.033 μ
0.047 μ
【Temperature Characteristic B7 : X7R】ꢀ1.15mm thickness（F）
Soldering
R:Reflow
W:Wave
R
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
1.15±0.10
Part number 1
HMK325 B7104[]FHT
●432TYPE
Part number 2
Rated voltage [V]
100
Rated voltage x ％
200
X7R
0.1 μ
±10，±20
3.5
【Temperature Characteristic B7 : X7R】 2.5mm thickness（M）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
HMK432 B7474[]MHT
HMK432 B7105[]MHT
HMK432 B7155[]MHT
HMK432 B7225[]MHT
QMK432 B7104[]MHT
QMK432 B7224[]MHT
QMK432 B7334[]MHT
QMK432 B7474[]MHT
SMK432 B7473[]MHT
SMK432 B7683[]MHT
SMK432 B7104[]MHT
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
0.47 μ
1 μ
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
3.5
3.5
3.5
3.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
200
200
200
200
150
150
150
150
120
120
120
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
2.5±0.20
R
R
R
R
R
R
R
R
R
R
R
100
1.5 μ
2.2 μ
0.1 μ
0.22 μ
0.33 μ
0.47 μ
0.047 μ
0.068 μ
0.1 μ
250
630
LW Reversal Decoupling Capacitors (LWDCTM
●105TYPE
)
【Temperature Characteristic BJ : X5R】 0.3mm thickness（P）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
TWK105 BJ104MPHF
EWK105 BJ224MPHF
LWK105 BJ474MPHF
AWK105 BJ105MPHF
25
16
10
4
X5R
X5R
X5R
X5R
0.1 μ
0.22 μ
0.47 μ
1 μ
±20
±20
±20
±20
5
150
150
150
150
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
R
R
R
R
10
10
10
【Temperature Characteristic C6 : X6S , C7 : X7S】 0.3mm thickness（P）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
EWK105 C6104MPHF
LWK105 C7104MPHF
LWK105 C6224MPHF
JWK105 C7104MPHF
JWK105 C7224MPHF
JWK105 C6474MPHF
AWK105 C7224MPHF
AWK105 C6474MPHF
16
10
X6S
X7S
X6S
X7S
X7S
X6S
X7S
X6S
0.1 μ
0.1 μ
±20
±20
±20
±20
±20
±20
±20
±20
5
150
150
150
150
150
150
150
150
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
0.3±0.05
R
R
R
R
R
R
R
R
5
0.22 μ
0.1 μ
10
5
6.3
4
0.22 μ
0.47 μ
0.22 μ
0.47 μ
10
10
10
10
●107TYPE
【Temperature Characteristic BJ : X5R】 0.5mm thickness（V）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
LWK107 BJ105MVHT
JWK107 BJ225MVHT
JWK107 BJ475MVHT
10
X5R
X5R
X5R
1 μ
2.2 μ
4.7 μ
±20
±20
±20
10
10
10
150
150
150
0.5±0.05
0.5±0.05
0.5±0.05
R
R
R
6.3
【Temperature Characteristic B7 : X7R , C6 : X6S , C7 : X7S】 0.5mm thickness（V）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
TWK107 B7104MVHT
EWK107 B7224MVHT
EWK107 B7474MVHT
LWK107 B7474MVHT
JWK107 C7105MVHT
AWK107 C6225MVHT
AWK107 C6475MVHT
25
16
X7R
X7R
X7R
X7R
X7S
X6S
X6S
0.1 μ
0.22 μ
0.47 μ
0.47 μ
1 μ
±20
±20
±20
±20
±20
±20
±20
5
5
150
150
150
150
150
150
150
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
0.5±0.05
R
R
R
R
R
R
R
5
10
5
6.3
10
10
10
2.2 μ
4.7 μ
4
●212TYPE
【Temperature Characteristic BJ : X5R】 0.85mm thickness（D）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
LWK212 BJ475[]DHT
JWK212 BJ106MDHT
AWK212 BJ226MDHT
10
6.3
4
X5R
X5R
X5R
4.7 μ
10 μ
22 μ
±10，±20
±20
10
10
10
150
150
150
0.85±0.10
0.85±0.10
0.85±0.10
R
R
R
±20
【Temperature Characteristic C6 : X6S】 0.85mm thickness（D）
Soldering
R:Reflow
W:Wave
R
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
0.85±0.10
Part number 1
Part number 2
Rated voltage [V]
6.3
Rated voltage x ％
150
JWK212 C6475[]DHT
X6S
4.7 μ
±10，±20
10
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
23
Notice for TAIYO YUDEN products(High Reliability Application Multilayer Ceramic Capacitors)
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2013. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-
rating such products, which are caused under the conditions other than those specified in this catalog or individual
specification.
■ Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is
available.
■ Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
■ High Reliability Application Multilayer Ceramic Capacitors are developed, designed and intended for use in high
riliability electronic appliances and electronic communication equipment or industrial equipment. However before
incorporating the components or devices into any equipment in the field such as transportation (train control, ship
control), transportation signal, disaster prevention, medical, public information network (telephone exchange, base
station) etc. which may have direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd.
for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called“TAIYO YUDEN’s official sales channel”).
It is only applicable to the products purchased from any of TAIYO YUDEN’s official sales channel.
■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-
cur in connection with a third party's intellectual property rights and other related rights arising from your usage of
products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to“Foreign Exchange and For-
eign Trade Control Law”of Japan,“U.S. Export Administration Regulations”, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
■PARTS NUMBER
High Reliability Application Multilayer Ceramic Capacitors
●107TYPE
【Temperature Characteristic B7 : X7R】 0.8mm thickness（A）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
UMR107 B7104[]A-T
TMR107 B7224[]A-T
EMR107 B7474[]A-T
LMR107 B7105[]A-T
50
25
16
10
X7R
X7R
X7R
X7R
0.1 μ
0.22 μ
0.47 μ
1 μ
±10，±20
±10，±20
±10，±20
±10，±20
3.5
3.5
3.5
5
200
200
200
200
0.8±0.10
0.8±0.10
0.8±0.10
0.8±0.10
R
R
R
R
●212TYPE
【Temperature Characteristic B7 : X7R】 1.25mm thickness（G）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
UMR212 B7473[]G-T
UMR212 B7104[]G-T
UMR212 B7224[]G-T
TMR212 B7474[]G-T
TMR212 B7105[]G-T
LMR212 B7225[]G-T
X7R
X7R
X7R
X7R
X7R
X7R
0.047 μ
0.1 μ
0.22 μ
0.47 μ
1 μ
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
3.5
3.5
3.5
3.5
5
200
200
200
200
200
200
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
1.25±0.10
R
R
R
R
R
R
50
25
10
2.2 μ
5
●316TYPE
【Temperature Characteristic B7 : X7R】 1.6mm thickness（L）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
UMR316 B7224[]L-T
TMR316 B7474[]L-T
TMR316 B7105[]L-T
EMR316 B7225[]L-T
LMR316 B7475[]L-T
JMR316 B7106[]L-T
50
25
X7R
X7R
X7R
X7R
X7R
X7R
0.22 μ
0.47 μ
1 μ
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
±10，±20
3.5
3.5
3.5
3.5
5
200
200
200
200
200
200
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
1.6±0.20
R
R
R
R
R
R
16
10
6.3
2.2 μ
4.7 μ
10 μ
5
●325TYPE
【Temperature Characteristic B7 : X7R】 2.5mm thickness（M）
Soldering
R:Reflow
W:Wave
R
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
2.5±0.20
Part number 1
Part number 2
Rated voltage [V]
25
Rated voltage x ％
200
TMR325 B7106[]M-T
X7R
10 μ
±10，±20
5
【Temperature Characteristic B7 : X7R】 1.9mm thickness（N）
Soldering
R:Reflow
W:Wave
HALT
Temperature
characteristics
Capacitance
[F]
Capacitance
tolerance [％]
tanδ
[％]
Thickness*3 [mm]
Part number 1
Part number 2
Rated voltage [V]
Rated voltage x ％
UMR325 B7474[]N-T
UMR325 B7105[]N-T
TMR325 B7225[]N-T
TMR325 B7475[]N-T
X7R
X7R
X7R
X7R
0.47 μ
1 μ
±10，±20
±10，±20
±10，±20
±10，±20
3.5
3.5
3.5
3.5
200
200
200
200
1.9±0.20
1.9±0.20
1.9±0.20
1.9±0.20
R
R
R
R
50
25
2.2 μ
4.7 μ
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
24
Multilayer Ceramic Capacitors
■PACKAGING
①Minimum Quantity
●Taped package
Thickness
Standard quantity [pcs]
Type(EIA)
mm
0.2
code
C, D
C
Paper tape
Embossed tape
□MK042(01005)
□VS042(01005)
□MK063(0201)
□WK105(0204) ※
－
40000
0.2
0.3
P, T
P
15000
10000
20000
15000
0.3
0.2
C
□MK105(0402)
0.3
P
－
0.5
V
10000
□VK105(0402) ※
□MK107(0603)
0.5
W
K
0.45
0.5
4000
－
□WK107(0306) ※
□MR107(0603)
V
4000
－
0.8
A
0.45
0.85
125
0.85
1.15
125
1.6
K
4000
□MK212(0805)
□WK212(0508)
□MR212(0805)
※
D
G
－
3000
－
D
4000
F
□MK316(1206)
□MR316(1206)
－
－
3000
2000
G
L
0.85
1.15
1.9
D
F
－
－
2000
□MK325(1210)
□MR325(1210)
N
2.0max.
2.5
Y
M
M
500（T）, 1000（P）
500
□MK432(1812)
2.5
Note : ※ LW Reverse type.
②Taping material
※No bottom tape for pressed carrier tape
●Card board carrier tape
●Embossed tape
Top tape
Top tape
Base tape
Sprocket hole
Chip cavity
Sprocket hole
Chip cavity
Bottom tape
Base tape
Chip filled
Chip
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E02R01
③Representative taping dimensions
●Paper Tape（8mm wide）
●Pressed carrier tape（ 2mm pitch）
Chip Cavity
Insertion Pitch
Ｆ
Tape Thickness
Type(EIA)
Ａ
Ｂ
Ｔ
T1
□MK063(0201)
0.37
0.67
0.45max.
0.42max.
□WK105(0204) ※
□MK105(0402) （*1 C）
□MK105(0402) （*1 P）
2.0±0.05
0.65
1.15
0.4max.
0.3max.
0.42max.
Unit：mm
0.45max.
Note *1 Thickness, C：0.2mm ,P：0.3mm. ※ LW Reverse type.
●Punched carrier tape （2mm pitch）
Chip Cavity
Type(EIA)
Insertion Pitch
Ｆ
Tape Thickness
Ｔ
Ａ
Ｂ
□MK105 (0402)
□VK105 (0402)
0.65
1.15
2.0±0.05
0.8max.
Unit：mm
●Punched carrier tape （4mm pitch）
Chip Cavity
Insertion Pitch
Ｆ
Tape Thickness
Ｔ
Type(EIA)
Ａ
Ｂ
□MK107(0603)
□WK107(0306)
□MR107(0603)
□MK212(0805)
□WK212(0508)
□MK316(1206)
※
※
1.0
1.8
1.1max.
4.0±0.1
1.65
2.0
2.4
3.6
1.1max.
Note：Taping size might be different depending on the size of the product. ※ LW Reverse type.
Unit：mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E02R01
●Embossed tape（4mm wide）
Chip Cavity
Insertion Pitch
Ｆ
Tape Thickness
Type(EIA)
Ａ
Ｂ
K
T
□MK042(01005)
□VS042(01005)
0.23
0.43
1.0±0.02
0.5max.
0.25max.
Unit：mm
●Embossed tape（8mm wide）
Chip Cavity
Insertion Pitch
Ｆ
Tape Thickness
Type(EIA)
Ａ
Ｂ
K
T
□WK107(0306) ※
□MK212(0805)
1.0
1.8
1.3max.
0.25±0.1
1.65
2.0
2.4
3.6
3.6
□MR212(0805)
4.0±0.1
□MK316(1206)
3.4max.
0.6max.
□MR316(1206)
□MK325(1210)
2.8
□MR325(1210)
Note： ※ LW Reverse type.
Unit：mm
●Embossed tape（12mm wide）
Chip Cavity
Insertion Pitch
Tape Thickness
Type(EIA)
Ａ
Ｂ
Ｆ
K
T
□MK432(1812)
3.7
4.9
8.0±0.1
4.0max.
0.6max.
Unit：mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E02R01
④Trailer and Leader
Blank portion
Chip cavity
Blank portion
Leader
100mm or more
160mm or more
(3.94inches or more)
(6.3inches or more)
400mm or more
(15.7inches or more)
Direction of tape feed
⑤Reel size
t
E
C
B
A
R
D
W
A
B
C
φ13.0±0.2
D
E
R
φ178±2.0
φ50min.
φ21.0±0.8
2.0±0.5
1.0
T
W
4mm wide tape
8mm wide tape
12mm wide tape
1.5max.
2.5max.
2.5max.
5±1.0
10±1.5
14±1.5
Unit：mm
⑥Top Tape Strength
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below.
Pull direction
0～20°
Top tape
Base tape
⑦Bulk Cassette
The exchange of individual specification is necessary.
Please contact Taiyo Yuden sales channels.
Slider
Shutter
2.0＋0/－0.1
1.0＋0/－0.1
1.5＋0.1/－0
12±0.1
Connecting Port
36＋0/－0.2
110±0.7
Unit：mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack_e-E02R01
Super Low Distortion Multilayer Ceramic Capacitors , Medium-High Voltage Multilayer Ceramic Capacitors and
High Reliability Application Multilayer Ceramic Capacitors are noted separately.
Multilayer Ceramic Capacitors
■RELIABILITY DATA
1.Operating Temperature Range
Standard
Temperature
－55 to ＋125℃
Compensating（Class1）
High Frequency Type
Specification
Temperature Range
－25 to ＋85℃
－55 to ＋85℃
－55 to ＋125℃
－55 to ＋105℃
－55 to ＋125℃
－55 to ＋85℃
－25 to ＋85℃
－30 to ＋85℃
B
BJ
X5R
X7R
X6S
X7S
X5R
F
Specified
Value
B7
C6
High Permittivity （Class2）
C7
LD(※)
F
Y5V
Note: ※LD Low distortion high value multilayer ceramic capacitor
2. Storage Conditions
Temperature
Standard
－55 to ＋125℃
Compensating（Class1）
High Frequency Type
Specification
Temperature Range
－25 to ＋85℃
－55 to ＋85℃
－55 to ＋125℃
－55 to ＋105℃
－55 to ＋125℃
－55 to ＋85℃
－25 to ＋85℃
－30 to ＋85℃
B
BJ
X5R
X7R
X6S
X7S
X5R
F
Specified
Value
B7
C6
High Permittivity （Class2）
C7
LD(※)
F
Y5V
Note: ※LD Low distortion high value multilayer ceramic capacitor
3. Rated Voltage
Standard
50VDC, 25VDC, 16VDC
Temperature
Specified
Value
Compensating（Class1）
High Frequency Type 50VDC, 25VDC, 16VDC
50VDC, 35VDC, 25VDC, 16VDC, 10VDC, 6.3VDC, 4VDC, 2.5VDC
High Permittivity （Class2）
4. Withstanding Voltage （Between terminals）
Temperature
Specified
Standard
Compensating（Class1）
High Frequency Type No breakdown or damage
Value
High Permittivity （Class2）
Class 1
Class 2
Rated voltage×2.5
Test
Applied voltage
Methods and
Duration
Rated voltage×3
1 to 5 sec.
50mA max.
Remarks
Charge/discharge current
5. Insulation Resistance
Temperature
Standard
High Frequency Type
10000 MΩ min.
Compensating（Class1）
Specified
Value
C≦0.047μF : 10000 MΩ min.
C＞0.047μF : 500MΩ・μF
High Permittivity （Class2） Note 1
Test
Applied voltage
Duration
: Rated voltage
Methods and
Remarks
: 60±5 sec.
: 50mA max.
Charge/discharge current
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E02R01
6. Capacitance （Tolerance）
Temperature
0.2pF≦C≦5pF
0.2pF≦C≦10pF
C＞10pF
: ±0.25pF
C□
U□
SL
Standard
: ±0.5pF
: ±5% or ±10%
Compensating（Class1）
Specified
Value
0.2pF≦C≦2pF
C＞2pF
: ±0.1pF
: ±5%
High Frequency Type
CH
BJ, B7, C6, C7, LD(※) : ±10% or ±20%,
F : ＋80/－20%
High Permittivity （Class2）
Note: ※LD Low distortion high value multilayer ceramic capacitor
Class 1
High Frequency Type
Class 2
Standard
C≦10μF
C＞10μF
Test
Preconditioning
None
Thermal treatment （at 150℃ for 1hr） Note 2
Methods and
Remarks
Measuring frequency
Measuring voltage Note
Bias application
1ＭHz±10%
0.5 to 5Vrms
1kHz±10%
1±0.2Vrms
120±10Hz
0.5±0.1Vrms
None
7. Q or Dissipation Factor
C＜30pF : Q≧400＋20C
C≧30pF : Q≧1000
Standard
Temperature
Compensating（Class1）
（C：Nominal capacitance）
Specified
Value
High Frequency Type Refer to detailed specification
High Permittivity （Class2） Note 1
BJ, B7, C6, C7：2.5% max., F：7% max.
Class 1
Class 2
Standard
High Frequency Type
C≦10μF
C＞10μF
Preconditioning
None
Thermal treatment （at 150℃ for 1hr） Note 2
Test
Measuring frequency
Measuring voltage Note 1
Bias application
1ＭHz±10%
1GHz
1ｋHz±10%
1±0.2Vrms
120±10Hz
Methods and
Remarks
0.5 to 5Vrms
0.5±0.1Vrms
None
High Frequency Type
Measuring equipment
Measuring jig
: HP4291A
: HP16192A
8. Temperature Characteristic （Without voltage application）
Temperature Characteristic ［ppm/℃］
Tolerance ［ppm/℃］
C□ :
0
CG,CH, CJ, CK
G : ±30
H : ±60
J : ±120
K : ±250
Standard
U□ : －750
UJ, UK
Temperature
Compensating（Class1）
SL : ＋350 to －1000
Temperature Characteristic ［ppm/℃］
Tolerance ［ppm/℃］
H : ±60
High Frequency Type
C□ :
0
CH
Capacitance
change
Reference
temperature
20℃
Specified
Value
Specification
Temperature Range
B
±10%
－25 to ＋85℃
－55 to ＋85℃
－55 to ＋125℃
－55 to ＋105℃
－55 to ＋125℃
－55 to ＋85℃
－25 to ＋85℃
－30 to ＋85℃
BJ
X5R
X7R
X6S
X7S
X5R
F
±15%
25℃
B7
C6
±15%
25℃
High Permittivity （Class2）
±22%
25℃
C7
±22%
25℃
LD(※)
±15%
25℃
＋30/－80%
＋22/－82%
20℃
F
Y5V
25℃
Note : ※LD Low distortion high value multilayer ceramic capacitor
Class 1
Capacitance at 20℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the
following equation.
（C85－C20）
×106（ppm/℃）
C20×△T
△T＝65
Test
Class 2
Methods and
Remarks
Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following
equation.
Step
B、F
X5R、X7R、X6S、X7S、Y5V
Minimum operating temperature
1
2
3
20℃
25℃
Maximum operating temperature
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E02R01
（C－C2）
C2
×100（%）
C
：Capacitance in Step 1 or Step 3
C2 ：Capacitance in Step 2
9. Deflection
Appearance
Capacitance change : Within ±5% or ±0.5 pF, whichever is larger.
Appearance : No abnormality
Capacitance change : Within±0.5 pF
Appearance : No abnormality
: No abnormality
Standard
Temperature
Compensating（Class1）
High Frequency Type
Specified
Value
Capacitance change : Within ±12.5%（BJ, B7, C6, C7,LD(※)）
Within ±30%（F）
High Permittivity （Class2）
Note: ※LD Low distortion high value multilayer ceramic capacitor
Multilayer Ceramic Capacitors
042, 063, ※105 Type
The other types
Board
Glass epoxy-resin substrate
Test
Thickness
Warp
0.8mm
1.6mm
Methods and
Remarks
1mm
Duration
10 sec.
※105 Type thickness, C： 0.2mm ,P： 0.3mm.
Capacitance measurement shall be conducted
with the board bent
10. Body Strength
Standard
－
Temperature
Specified
Value
Compensating（Class1）
High Frequency Type No mechanical damage.
－
High Permittivity （Class2）
High Frequency Type
Applied force
Duration
: 5N
Test
: 10 sec.
Methods and
Remarks
11. Adhesive Strength of Terminal Electrodes
Temperature
Standard
Specified
Compensating（Class1）
High Frequency Type No terminal separation or its indication.
Value
High Permittivity （Class2）
Multilayer Ceramic Capacitors
042, 063 Type
2N
105 Type or more
5N
Test
Methods and
Remarks
Applied force
Duration
30±5 sec.
12. Solderability
Standard
High Frequency Type At least 95% of terminal electrode is covered by new solder.
Temperature
Specified
Value
Compensating（Class1）
High Permittivity （Class2）
Eutectic solder
H60A or H63A
230±5℃
Lead-free solder
Sn-3.0Ag-0.5Cu
245±3℃
Test
Solder type
Methods and
Remarks
Solder temperature
Duration
4±1 sec.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E02R01
13. Resistance to Soldering
Appearance
: No abnormality
Capacitance change
Q
: Within ±2.5% or ±0.25pF, whichever is larger.
: Initial value
Standard
Insulation resistance
Withstanding voltage
: Initial value
（between terminals） : No abnormality
Temperature
Compensating（Class1）
Appearance
: No abnormality
Capacitance change
Q
: Within ±2.5%
: Initial value
High Frequency Type
Specified
Value
Insulation resistance
Withstanding voltage
: Initial value
（between terminals） : No abnormality
Appearance
: No abnormality
Capacitance change
: Within ±7.5%（BJ, B7, C6, C7, LD(※)）
Within ±20%（F）
High Permittivity （Class2） Note 1
Dissipation factor
: Initial value
Insulation resistance
Withstanding voltage
: Initial value
（between terminals）: No abnormality
Note: ※LD Low distortion high value multilayer ceramic capacitor
Class 1
042, 063 Type
105 Type
Preconditioning
Preheating
None
80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5 min.
270±5℃
150℃, 1 to 2 min.
Solder temp.
Duration
3±0.5 sec.
Recovery
6 to 24 hrs （Standard condition） Note 5
Test
Methods and
Remarks
Class 2
105, 107, 212 Type
042、063 Type
316, 325 Type
Preconditioning
Preheating
Thermal treatment （at 150℃ for 1 hr） Note 2
80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5 min.
270±5℃
80 to 100℃, 5 to 10 min.
150 to 200℃, 5 to 10 min.
150℃, 1 to 2 min.
Solder temp.
Duration
3±0.5 sec.
Recovery
24±2 hrs （Standard condition） Note 5
14. Temperature Cycle (Thermal Shock）
Appearance
: No abnormality
Capacitance change
Q
: Within ±2.5% or ±0.25pF, whichever is larger.
: Initial value
Standard
Insulation resistance
Withstanding voltage
: Initial value
（between terminals） : No abnormality
Temperature
Compensating（Class1）
Appearance
: No abnormality
Capacitance change
Q
: Within ±0.25pF
: Initial value
High Frequency Type
Specified
Value
Insulation resistance
Withstanding voltage
: Initial value
（between terminals） : No abnormality
Appearance
: No abnormality
Capacitance change
: Within ±7.5% （BJ, B7, C6, C7, LD(※)）
Within ±20% （F）
High Permittivity （Class2） Note 1
Dissipation factor
: Initial value
Insulation resistance
Withstanding voltage
: Initial value
（between terminals） : No abnormality
Note: ※LD Low distortion high value multilayer ceramic capacitor
Class 1
None
Class 2
Thermal treatment （at 150℃ for 1 hr）
Note 2
Preconditioning
Step
Temperature（℃）
Time（min.）
Test
1
2
3
4
Minimum operating temperature
Normal temperature
30±3
2 to 3
30±3
2 to 3
Methods and
Remarks
1 cycle
Maximum operating temperature
Normal temperature
Number of cycles
Recovery
5 times
6 to 24 hrs （Standard condition） Note 5
24±2 hrs （Standard condition） Note 5
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E02R01
15. Humidity （Steady State）
Appearance
: No abnormality
Capacitance change
Q
: Within ±5% or ±0.5pF, whichever is larger.
: C＜10pF : Q≧200＋10C
Standard
10≦C＜30pF : Q≧275＋2.5C
C≧30pF:Q≧350（C：Nominal capacitance）
: 1000 MΩ min.
Temperature
Compensating（Class1）
Insulation resistance
Appearance
: No abnormality
: Within ±0.5pF,
: 1000 MΩ min.
Specified
Value
High Frequency Type Capacitance change
Insulation resistance
Appearance
: No abnormality
Capacitance change
: Within ±12.5% （BJ, B7, C6, C7, LD(※)）
Within ±30% （F）
High Permittivity （Class2） Note 1
Dissipation factor
: 5.0% max.（BJ, B7, C6, C7, LD(※)）
11.0% max.（F）
Insulation resistance
: 50 MΩμF or 1000 MΩ whichever is smaller.
Note: ※LD Low distortion high value multilayer ceramic capacitor
Class 1
Class 2
All items
Standard
40±2℃
High Frequency Type
60±2℃
Preconditioning
Temperature
Humidity
None
Thermal treatment（ at 150℃ for 1 hr） Note 2
40±2℃
Test
Methods and
Remarks
90 to 95%RH
90 to 95%RH
Duration
500＋24/－0 hrs
500＋24/－0 hrs
Recovery
6 to 24 hrs （Standard condition） Note 5
24±2 hrs （Standard condition） Note 5
16. Humidity Loading
Appearance
: No abnormality
Capacitance change
: Within ±7.5% or ±0.75pF, whichever is larger.
: C＜30pF：Q≧100＋10C/3
Standard
Q
C≧30pF：Q≧200 （C：Nominal capacitance）
: 500 MΩ min.
Insulation resistance
Temperature
Compensating（Class1）
Appearance
: No abnormality
Capacitance change
: C≦2pF：Within ±0.4 pF
C＞2pF：Within ±0.75 pF
（C：Nominal capacitance）
: 500 MΩ min.
High Frequency Type
Specified
Value
Insulation resistance
Appearance
: No abnormality
Capacitance change
: Within ±12.5% （BJ, B7, C6, C7, LD(※)）
Within ±30% （F）
High Permittivity （Class2） Note 1
Dissipation factor
: 5.0% max. （BJ, B7, C6, C7, LD(※)）
11.0% max. （F）
Insulation resistance
: 25 MΩμF or 500 MΩ, whichever is smaller.
Note: ※LD Low distortion high value multilayer ceramic capacitor
Class 1
Class 2
Standard
High Frequency Type
All items
Preconditioning
Voltage treatment
None
（Rated voltage are applied for 1 hour at 40℃） Note 3
Temperature
Humidity
40±2℃
60±2℃
40±2℃
Test
Methods and
Remarks
90 to 95%RH
500＋24/－0 hrs
Rated voltage
90 to 95%RH
Duration
500＋24/－0 hrs
Rated voltage
Applied voltage
Charge/discharge
current
50mA max.
50mA max.
Recovery
6 to 24 hrs （Standard condition） Note 5
24±2 hrs（Standard condition） Note 5
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E02R01
17. High Temperature Loading
Appearance
: No abnormality
Capacitance change
Q
: Within ±3% or ±0.3pF, whichever is larger.
: C＜10pF： Q≧200＋10C
Standard
10≦C＜30pF：Q≧275＋2.5C
C≧30pF： Q≧350（C：Nominal capacitance）
: 1000 MΩ min.
Temperature
Compensating（Class1）
Insulation resistance
Appearance
: No abnormality
Specified
Value
High Frequency Type Capacitance change
Insulation resistance
: Within ±3% or ±0.3pF, whichever is larger.
: 1000 MΩ min.
Appearance
: No abnormality
Capacitance change
: Within ±12.5% （BJ, B7, C6, C7, LD(※)）
Within ±30% （F）
High Permittivity （Class2） Note 1
Dissipation factor
: 5.0% max.（BJ, B7, C6, C7, LD(※)）
11.0% max.（F）
Insulation resistance
: 50 MΩμF or 1000 MΩ, whichever is smaller.
Note: ※LD Low distortion high value multilayer ceramic capacitor
Class 1
High Frequency Type
Class 2
C6
Standard
BJ, LD(※), F
B7, C7
Voltage treatment（Twice the rated voltage shall be applied for
1 hour at 85℃, 105℃ or 125℃） Note 3, 4
Maximum operating temperature
Preconditioning
None
Temperature
Duration
Maximum operating temperature
1000＋48/－0 hrs
Test
1000＋48/－0 hrs
Methods and
Remarks
Applied voltage
Charge/discharge
current
Rated voltage×2
Rated voltage×2 Note 4
50mA max.
50mA max.
Recovery
6 to 24hr （Standard condition） Note 5
24±2 hrs （Standard condition） Note 5
Note: ※LD Low distortion high value multilayer ceramic capacitor
Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail.
Note 2 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature for
24±2hours.
Note 3 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in
the test conditions, and kept at room temperature for 24±2hours.
Note 4 150% of rated voltage is applicable to some items. Please refer to their specifications for further information.
Note 5 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa When there are questions concerning
measurement results, in order to provide correlation data, the test shall be conducted under the following condition.
Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa Unless otherwise specified, all the tests are conducted under the
"standard condition".
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-E02R01
Multilayer Ceramic Capacitors , Super Low Distortion Multilayer Ceramic Capacitors and
High Reliability Application Multilayer Ceramic Capacitors are noted separately.
Medium-High Voltage Multilayer Ceramic Capacitor
■RELIABILITY DATA
1. Operating Temperature Range
X7R, X7S : －55 to ＋125℃
Specified Value
X5R
B
: －55 to ＋85℃
: －25 to ＋85℃
2. Storage Temperature Range
X7R, X7S : －55 to ＋125℃
Specified Value
X5R
B
: －55 to ＋85℃
: －25 to ＋85℃
3. Rated Voltage
Specified Value
100VDC(HMK), 250VDC(QMK), 630VDC(SMK)
4. Withstanding Voltage（Between terminals）
Specified Value
No breakdown or damage
Applied voltage
Duration
: Rated voltage×2.5（HMK）, Rated voltage×2（QMK）, Rated voltage×1.2（SMK）
Test Methods and
Remarks
: 1 to 5sec.
: 50mA max.
Charge/discharge current
5. Insulation Resistance
Specified Value
100MΩ・μF or 10GΩ, whichever is smaller.
Applied voltage
Duration
: Rated voltage（HMK, QMK）, 500V（SMK）
Test Methods and
Remarks
: 60±5sec.
: 50mA max.
Charge/discharge current
6. Capacitance （Tolerance）
Specified Value
±10%, ±20%
Measuring frequency
Measuring voltage
Bias application
: 1kHz±10%
: 1±0.2Vrms
: None
Test Methods and
Remarks
7. Dissipation Factor
Specified Value
3.5%max（HMK）
2.5%max（QMK, SMK）
Measuring frequency
Measuring voltage
Bias application
: 1kHz±10%
: 1±0.2Vrms
: None
Test Methods and
Remarks
8. Temperature Characteristic of Capacitance
B
: ±10%（－25 to ＋85℃）
: ±15%（－55 to ＋85℃）
X5R
X7R
X7S
Specified Value
: ±15%（－55 to ＋125℃）
: ±22%（－55 to ＋125℃）
Capacitance value at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the
following equation.
Step
B
X5R、X7R、X7S
Minimum operating temperature
20℃ 25℃
1
2
3
Test Methods and
Remarks
Maximum operating temperature
（C－C2）
C2
×100（%）
C
: Capacitance value in Step 1 or Step 3
C2 : Capacitance value in Step 2
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_mhv_reli_e-E02R01
9. Deflection
Appearance
: No abnormality
: Within±10%
Specified Value
Capacitance change
Warp
: 1mm
: 10sec.
Duration
Test board
Thickness
: Glass epoxy-resin substrate
: 1.6mm
Test Methods and
Remarks
Capacitance measurement shall be conducted with the board bent.
10. Adhesive Strength of Terminal Electrodes
Specified Value
No terminal separation or its indication.
Applied force
Duration
: 5N
: 30±5sec.
Test Methods and
Remarks
11. Solderability
Specified Value
At least 95% of terminal electrode is covered by new solder
Eutectic solder
Lead-free solder
Sn-3.0Ag-0.5Cu
245±3℃
Solder type
H60A or H63A
230±5℃
Test Methods and
Remarks
Solder temperature
Duration
4±1 sec.
12. Resistance to Soldering
Appearance
: No abnormality
Capacitance change
Dissipation factor
: Within±15%（HMK）, ±10%（QMK, SMK）
: Initial value
Specified Value
Insulation resistance
Withstanding voltage
: Initial value
（between terminals） : No abnormality
Preconditioning
: Thermal treatment（at 150℃ for 1hr） Note1
: 270±5℃
Solder temperature
Test Methods and Duration
Remarks Preheating conditions
: 3±0.5sec.
: 80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5min.
Recovery
: 24±2hrs under the standard condition Note3
13. Temperature Cycle （Thermal Shock）
Appearance
: No abnormality
Capacitance change
Specified Value
: Within±15%（HMK）, ±7.5%（QMK, SMK）
: Initial value
Dissipation factor
Insulation resistance
: Initial value
Preconditioning : Thermal treatment （at 150℃ for 1hr） Note1
Conditions for 1 cycle
Step
Temperature（℃）
Minimum operating temperature
Normal temperature
Time（min.）
30±3min.
2 to 3min.
30±3min.
2 to 3min.
1
2
3
4
Test Methods and
Remarks
Maximum operating temperature
Normal temperature
Number of cycles : 5 times
Recovery : 24±2hrs under the standard condition Note3
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_mhv_reli_e-E02R01
14. Humidity （Steady state）
Appearance
: No abnormality
Capacitance change
Dissipation factor
: Within±15%
Specified Value
: 7%max（HMK）, 5%max（QMK, SMK）.
: 25MΩμF or 1000MΩ, whichever is smaller.
Insulation resistance
Preconditioning
Temperature
Humidity
: Thermal treatment（at 150℃ for 1hr） Note1
: 40±2℃
Test Methods and
Remarks
: 90 to 95%RH
: 500 ＋24/－0 hrs
Duration
Recovery
: 24±2hrs under the standard condition Note3
15. Humidity Loading
Specified Value
Appearance
: No abnormality
Capacitance change
Dissipation factor
Insulation resistance
: Within±15%
: 7%max（HMK）, 5%max（QMK, SMK）.
: 10MΩμF or 500MΩ, whichever is smaller.
According to JIS 5102 clause 9.9.
Preconditioning
Temperature
: Voltage treatment Note2
: 40±2℃
Test Methods and Humidity
Remarks Applied voltage
: 90 to 95%RH
: Rated voltage
Charge/discharge current
Duration
: 50mA max.
: 500 ＋24/－0 hrs
: 24±2hrs under the standard condition Note3
Recovery
16. High Temperature Loading
Appearance
: No abnormality
Capacitance change
Dissipation factor
: Within±15%
Specified Value
: 7%max（HMK）, 5%max（QMK, SMK）.
: 50MΩμF or 1000MΩ, whichever is smaller.
Insulation resistance
According to JIS 5102 clause 9.10.
Preconditioning
Temperature
: Voltage treatment Note2
: Maximum operating temperature
: Rated voltage×2（HMK）
Rated voltage×1.5（QMK）
Rated voltage×1.2（SMK）
: 50mA max.
Applied voltage
Test Methods and
Remarks
Charge/discharge current
Duration
: 1000 ＋24/－0 hrs
Recovery
: 24±2hrs under the standard condition Note3
Note1 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at
24±2hours.
room temperature for
Note2 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in the
test conditions, and kept at room temperature for 24±2hours.
Note3 Standard condition : Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa
When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted
under the following condition.
Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa
Unless otherwise specified, all the tests are conducted under the "standard condition".
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_mhv_reli_e-E02R01
Multilayer Ceramic Capacitors, Super Low Distortion Multilayer Ceramic Capacitors and
Medium-High Voltage Multilayer Ceramic Capacitors are noted separately.
High Reliability Application Multilayer Ceramic Capacitors
■RELIABILITY DATA
1. Operating Temperature Range
Specified Value
X7R（－55℃ to ＋125℃）
Continuous use is available in this range. （reference temperature : 25℃）
Test Methods and
Remarks
2.Highest Operating temperature Range
Specified Value
X7R（－55℃ to ＋125℃）
Maximum ambient temperature at which capacitors can be continuously used with rated voltage applied.
Test Methods and
Remarks
3. Rated Voltage
Specified Value
Please refer to the page of the "PARTS NUMBER".
Test Methods and Continuous maximum applied voltage. If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages should be lower than
Remarks the rated voltage of the capacitor.
4. Shape and Dimensions
Specified Value
Please refer to the page of the "EXTERNAL DIMENSIONS".
５. Heat Treatment （ClassⅡ）
Test Methods and Initial value shall be measured after test sample is heat－treated at 150＋0/－10℃ for an hour and kept at room temperature for 24 ±
Remarks
2 hours.
6. Voltage Treatment （ClassⅡ）
Test Methods and Initial value shall be measured after test sample is voltage－treated for an hour at temperature and voltage which are specified as test
Remarks
conditions, and kept at room temperature for 24 ±2 hours.
７. Dielectric Withstanding Voltage （between terminals）
Specified Value
No abnormality.
Applied voltage
Duration
: Rated voltage × 2.5
: 1 to 5 seconds.
Test Methods and
Remarks
Charging and discharging current shall be 50mA max.
8. Insulation Resistance
Specified Value
Larger than whichever smaller of 500 MΩ・μF or 104 MΩ
Applied voltage
Duration
: Rated voltage
Test Methods and
Remarks
: 60±5 seconds.
Charging and discharging current shall be 50mA max.
9. Capacitance and Tolerance
Specified Value Please refer to the page of the "PARTS NUMBER".
Measurement frequency
: 1KHz±10%（C≦10μF）
: 1±0.2Vrms（C≦10μF）
0.5±0.1V（6.3V rated voltage）
Test Methods and Measurement voltage
Remarks
Heat treatment specified in No.5 of the specification shall be conducted prior to measurement.
10. Q or Dissipation factor （tanδ）
Specified Value Please refer to the page of the "PARTS NUMBER".
Measurement frequency : 1KHz±10%（C≦10μF）
Test Methods and Measurement voltage
Remarks
: 1±0.2Vrms（C≦10μF）
0.5±0.1V（6.3V rated voltage）
Heat treatment specified in No.5 of the specification shall be conducted prior to measurement. NO DC bias is applied.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_MR_reli_e-E02R01
11. Temperature Characteristic （without DC bias）
Specified Value
X7R（－55℃ to ＋125℃）：±15%
Confirming to EIA RS－198－D （1991）
Heat treatment specified in No.5 of the specification shall be conducted prior to measurement.
Change of the maximum capacitance deviation in step 1 to 5.
step
Temperature（℃）
Test Methods and
Remarks
1
2
3
4
5
＋25
Minimum operating temperature
＋25
Maximum operating temperature
＋25
12. Adhesive Force of Terminal Electrodes
Specified Value
Appearance：Terminal electrodes shall be no exfoliation or a sign of exfoliation.
Solder lands refer to fig.1.
1608 size
5N
larger than 2012 size
10Ｎ
Applying force
Duration
30±5 seconds.
Board
Glass epoxy-resin substrate
1.6mm
Thickness
Test Methods and
Remarks
Case size
Dimension
1608
1.0
2012
3216
2.2
3225
2.2
a
b
c
1.2
4.0
3.0
5.0
5.0
1.2
1.65
2.0
2.9
Fig.1
13. Vibration
Appearance
: No abnormality.
Capacitance change
Dissipation factor
Insulation resistance
: Initial value shall be satisfied.
: Initial value shall be satisfied.
: Initial value shall be satisfied.
Specified Value
Heat treatment specified in No.5 of the specification shall be conducted prior to test. Measurement shall be conducted after test sample is
heat treated as specified in No.5.
Solder lands refer to figure 1.
Test Methods and
Remarks
Direction of the vibration test
Vibration frequency
: X, Y, Z each of 3 orientations for 2 hours respectively （total 6 hours）
: 10 to 55 to 10Hz （1 minutes each）
: 1.5 mm
Total amplitude
Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours.
14. Resistance to Soldering Heat
Appearance
: No abnormality
: ≦±7.5%
Capacitance change
Specified Value
Dissipation factor
: Initial value shall be satisfied.
: Initial value shall be satisfied.
（between terminals） : No abnormality
Insulation resistance
Dielectric withstanding voltage
Heat treatment specified in No.5 of the specification shall be conducted prior to test.
Immerse test sample in an solder solution （Sn-3Ag-0.5Cu）.
Soldering temperature
Test Methods and Duration
: 270℃±5℃
: 3±0.5 seconds
Remarks
Soaking position
Preheating condition
: Test sample is soaked until the terminal electrode is covered in solder solution.
: 3216 size or smaller size：120 to 150℃ for 1 minute,
3225 size：100 to 120℃ for 1 minute, 170 to 200℃ for 1 minute.
Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours.
15. Solderability
Specified Value
More than 95% of terminal electrode shall be covered with fresh solder.
Heat treatment specified in No.5 of the specification shall be conducted prior to test.
Immerse test sample in an solder solution（Sn-3Ag-0.5Cu）.
Test Methods and
Remarks
Soldering temperature
Duration
: 245℃±5℃
: 4±1 seconds
Dipping position
: Test sample is immersed until the terminal electrode is covered in solder solution.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_MR_reli_e-E02R01
16. Thermal shock
Specified Value
Appearance
: No abnormality
Capacitance change
Dissipation factor
: ≦±7.5%
: Initial value shall be satisfied.
: Initial value shall be satisfied.
（between terminals） : No abnormality
Insulation resistance
Dielectric withstanding voltage
Heat treatment specified in No.5 of the specification shall be conducted prior to test.
Measurement shall be conducted after test sample is heat treated as specified in No.5.
condition of the one cycle （Air－Air）
Step
Temperature（℃）
Time（min.）
Transfer time
within 20 seconds
within 20 seconds
1
Minimum usage temperature
Maximum usage temperature
15
15
2
Test cycles：100 times.
Test Methods and
Remarks
Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours.
Case size
Dimension
1608
0.6
2012
0.8
3216
2.0
3225
2.0
a
b
c
2.2
3.0
4.4
4.4
0.9
1.3
1.7
2.6
Fig.2
17. Humidity Loading
Appearance
: No abnormality
: ±12.5%
Specified Value
Note1
Capacitance change
Dissipation factor
Insulation resistance
: 5.0%max.
: Larger than whichever smaller of 25MΩ・μF or 500MΩ
Test condition
Duration
: 85℃/85%RH.
: 1000 ＋48/－0 hours.
: Applied rated voltage.
Test Methods and
Remarks
DC bias
Voltage treatment specified in No.6 of the specification shall be conducted prior to test.
Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours.
18. High Temperature Loading
Appearance
: No abnormality
Specified Value
Note1
Capacitance change
Dissipation factor
: ≦±12.5%
: 5.0%max.
Insulation resistance
: Larger than whichever smaller of 50MΩ・μF or 1000MΩ
Voltage treatment specified in No.6 of the specification shall be conducted prior to test.
Test sample shall be put in thermostatic oven with maximum temperature.
Test Methods and Applied voltage
Remarks Duration
: Rated voltage x 2
: 1000 ＋48/－0 hours.
Charging and discharging current shall be 50mA or less.
Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours.
19. Resistance to Flexure of substrate
Appearance
: No abnormality
: ≦±12.5%
Capacitance change
Specified Value
Dissipation factor
: 5.0%max.
Insulation resistance
: Initial value shall be satisfied.
Warp
: 2ｍｍ
Testing board
Thickness
: Grass epoxy - resin substrate
: 1.6ｍｍ
Test board and solder lands
: Refer to fig. 3.
Case size
Test Methods and
Remarks
Dimension
1608
0.6
2012
3216
2.0
3225
2.0
a
b
c
0.8
3.0
1.3
2.2
4.4
4.4
0.9
1.7
2.6
Fig.4
Fig.3
Measurement shall be made with board in the bent position.（fig.4）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_MR_reli_e-E02R01
20. High Temperature Exposure
Appearance
: No abnormality
Specified Value
Note1
Capacitance change
: ≦±12.5%
Dissipation factor
: 5.0%max.
Insulation resistance
: Larger than whichever smaller of 500MΩ・μF or 10000MΩ
Heat treatment specified in No.5 of the specification shall be conducted prior to test.
Test sample shall be put in thermostatic oven with maximum temperature.
Duration : 1000 ＋48/－0 hours.
Test Methods and
Remarks
Initial value shall be measured after test sample is heat－treated specified No.5.
Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours.
21. Temperature Cycling
Appearance
: No abnormality
Specified Value
Note1
Capacitance change
Dissipation factor
: ≦±7.5%
: Initial value shall be satisfied
: Initial value shall be satisfied
Insulation resistance
Heat treatment specified in No.5 of the specification shall be conducted prior to test.
Measurement shall be conducted after test sample is heat treated as specified in No.5.
condition of the one cycle
Step
Temperature（℃）
Minimum usage temperature
＋25
Time（min.）
30±3
1
Test Methods and
Remarks
2
2 to 3
3
Maximum usage temperature
＋25
30±3
4
2 to 3
Test cycles：200 times
Solder lands refer to fig. 2.
Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours.
Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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High Reliability Application Multilayer Ceramic Capacitors are noted separately.
Precautions on the use of Multilayer Ceramic Capacitors
■PRECAUTIONS
1. Circuit Design
◆Verification of operating environment, electrical rating and performance
1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have
severe social ramifications.
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from
them used in general purpose applications.
Precautions
◆Operating Voltage （Verification of Rated voltage）
1. The operating voltage for capacitors must always be their rated voltage or less.
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC
voltage or a pulse voltage having rapid rise time is used in a circuit.
2. PCB Design
◆Pattern configurations （Design of Land-patterns）
1. When capacitors are mounted on PCBs, the amount of solder used （size of fillet） can directly affect the capacitor performance.
Therefore, the following items must be carefully considered in the design of land patterns:
（1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider
appropriate land-patterns for proper amount of solder.
Precautions
（2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by
solder-resist.
◆Pattern configurations （Capacitor layout on PCBs）
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB
cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land
pattern configurations and positions of capacitors shall be carefully considered to minimize stresses.
◆Pattern configurations （Design of Land-patterns）
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.
（1）Recommended land dimensions for typical chip capacitors
●Multilayer Ceramic Capacitors : Recommended land dimensions
Land patterns for PCBs
Land pattern
（unit: mm）
Solder-resist
Wave-soldering
Chip capacitor
Type
107
1.6
212
2.0
316
3.2
325
3.2
L
C
Size
W
0.8
1.25
1.6
2.5
A
B
C
0.8 to 1.0
0.5 to 0.8
0.6 to 0.8
1.0 to 1.4
0.8 to 1.5
0.9 to 1.2
1.8 to 2.5
0.8 to 1.7
1.2 to 1.6
1.8 to 2.5
0.8 to 1.7
1.8 to 2.5
B
A
B
Chip capacitor
W
L
Technical
Reflow-soldering
Type 042
considerations
063
0.6
105
1.0
107
1.6
0.8
212
2.0
316
325
3.2
2.5
432
4.5
L
0.4
3.2
Size
W
0.2
0.3
0.5
1.25
1.6
3.2
A
B
C
0.15 to 0.25
0.15 to 0.20
0.15 to 0.30
0.20 to 0.30
0.20 to 0.30
0.25 to 0.40
0.45 to 0.55
0.40 to 0.50
0.45 to 0.55
0.8 to 1.0
0.8 to 1.2
0.8 to 1.2
0.9 to 1.6
1.8 to 2.5
1.0 to 1.5
1.2 to 2.0
1.8 to 2.5
1.0 to 1.5
1.8 to 3.2
2.5 to 3.5
1.5 to 1.8
2.3 to 3.5
0.6 to 0.8
0.6 to 0.8
Note：Recommended land size might be different according to the allowance of the size of the product.
LWDC
●LWDC: Recommended land dimensions for reflow-soldering
（unit: mm）
Type
105
0.52
107
0.8
212
1.25
L
W
Size
W
1.0
1.6
2.0
A
B
C
0.18 to 0.22
0.2 to 0.25
0.9 to 1.1
0.25 to 0.3
0.3 to 0.4
1.5 to 1.7
0.5 to 0.7
0.4 to 0.5
1.9 to 2.1
L
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
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（2）Examples of good and bad solder application
Item
Not recommended
Recommended
Solder-resist
Lead wire of component
Mixed mounting of SMD and
leaded components
Chassis
Solder-resist
Solder (for grounding)
Component placement close to
the chassis
Electrode pattern
Lead wire of component
Soldering iron
Solder-resist
Hand-soldering of leaded
components near mounted
components
Solder-resist
Horizontal component
placement
◆Pattern configurations （Capacitor layout on PCBs）
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any
stresses from board warp or deflection.
possible mechanical
Items
Not recommended
Recommended
Place the product at a right
angle to the direction of the
anticipated mechanical
stress.
Deflection of board
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
E
D
Perforation
C
A
B
Slit
Magnitude of stress A＞B＝C＞D＞E
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods
are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB,
split methods as well as chip location.
3. Mounting
Precautions
◆Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2. Maintenance and inspection of mounting machines shall be conducted periodically.
◆Selection of Adhesives
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the
following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and
hardening period. Therefore, please contact us for further information.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
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◆Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid
this, the following points shall be considerable.
（1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
（2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
（3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be
used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle
placement:
Item
Improper method
Proper method
chipping
or cracking
Single-sided mounting
supporting pins
or back-up pins
Double-sided mounting
chipping
or cracking
supporting pins
or back-up pins
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical
impact on the capacitors.
Technical
considerations
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of
the pin shall be conducted periodically.
◆Selection of Adhesives
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in
stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect
components. Therefore, the following precautions shall be noted in the application of adhesives.
（1）Required adhesive characteristics
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have sufficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
f. The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
（2）The recommended amount of adhesives is as follows;
［Recommended condition］
Amount adhesive
After capacitor are bonded
a
a
Figure
212/316 case sizes as examples
a
b
c
0.3mm min
100 to 120μm
b
Adhesives shall not contact land
c
c
4. Soldering
◆Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
（1）Flux used shall be less than or equal to 0.1 wt%（ in Cl equivalent） of halogenated content. Flux having a strong acidity content shall
not be applied.
（2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
（3）When water-soluble flux is used, special care shall be taken to properly clean the boards.
Precautions
◆Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.） content is used to activate flux, or highly acidic flux is used, it may lead to
corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted
and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high
humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning
methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used.
Technical
considerations
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E02R01
◆Soldering
･ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
･ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal
shock.
･ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within
100 to 130℃.
･ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.
［Reflow soldering］
【Recommended conditions for eutectic
soldering】
300
【Recommended condition for Pb-free
soldering】
300
Peak
Preheating
230℃
260℃ Max.
Within 10sec.
Within 10sec.
60sec. 60sec
Min.
Min.
200
100
0
200
Slow
Slow cooling
cooling
100
Heating above
230℃
Preheating150℃
60sec. Min.
40sec. Max.
0
1/2T～1/3T
Caution
Capacitor
PC board
①The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the
thickness of a capacitor.
Solder
T
②Because excessive dwell times can adversely affect solderability, soldering duration shall
be kept as close to recommended times as possible.
［Wave soldering］
【Recommended conditions for eutectic
【Recommended condition for Pb-free
soldering】
soldering】
300
300
Peak
260℃ Max.
Within 10sec.
230～250℃
Within 3sec.
Preheating
120sec. Min.
120sec. Min.
200
200
100
0
Slow
cooling
Slow cooling
Preheating
150℃
100
0
Caution
①Wave soldering must not be applied to capacitors designated as for reflow soldering only.
［Hand soldering］
【Recommended conditions for eutectic
【Recommended condition for Pb-free
soldering】
soldering】
400
400
400
300
200
100
0
Peak
350℃ Max.
Within 3sec.
Peak
280℃ Max.
Within 3sec.
230～280℃
Within 3sec.
300
300
⊿T
Slow cooling
200
Slow cooling
⊿T
200
Slow cooling
Preheating
150℃ Min.
Preheating
150℃ Min.
100
100
Preheating
60sec. Min.
0
60sec. Min.
60sec. Min.
0
⊿T
⊿T
⊿T≦130℃
316type or less
⊿T≦150℃
325type or more
Caution
①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
②The soldering iron shall not directly touch capacitors.
5. Cleaning
Precautions
◆Cleaning conditions
1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use
of the cleaning. （e.g. to remove soldering flux or other materials from the production process.）
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect
capacitor's characteristics.
1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate
their outer coating, resulting in a degradation of the capacitor's electrical properties （especially insulation resistance）.
2. Inappropriate cleaning conditions（ insufficient or excessive cleaning） may adversely affect the performance of
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead
the capacitors.
to the
Technical
cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall
be carefully checked;
considerations
Ultrasonic output :
20 W/ℓ or less
40 kHz or less
Ultrasonic frequency :
Ultrasonic washing period : 5 min. or less
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E02R01
6. Resin coating and mold
1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the
while left under normal storage conditions resulting in the deterioration of the capacitor's performance.
hardening period or
Precautions
2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat
may lead to damage or destruction of capacitors.
The use of such resins, molding materials etc. is not recommended.
7. Handling
◆Splitting of PCB
1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.
2. Board separation shall not be done manually, but by using the appropriate devices.
Precautions
◆Mechanical considerations
Be careful not to subject capacitors to excessive mechanical shocks.
（1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.
（2）Please be careful that the mounted components do not come in contact with or bump against other boards or
components.
8. Storage conditions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control
temperature and humidity in the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Ambient temperature : Below 30℃
Humidity
: Below 70% RH
Precautions
The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as
time passes, so capacitors shall be used within 6 months from the time of delivery.
・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.
2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so
care shall be
taken to design circuits . Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at
150℃ for 1hour.
If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and
quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the
above period, please check solderability before using the capacitors.
Technical
considerations
※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA.
Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E02R01
Precautions on the use of High Reliability Application Multilayer Ceramic Capacitors
■PRECAUTIONS
1.Circuit Design
◆Verification of operating environment, electrical rating and performance
1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social
ramifications.
As such, any capacitors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly
differentiated from components used in general purpose applications.
◆Operating Voltage （Verification of Rated voltage）
Precautions
1. The operating voltage for capacitors must always be lower than their rated values.
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages should be lower than the rated value of the capacitor
chosen. For a circuit where both an AC and a pulse voltage may be present, the sum of their peak voltages should also be lower than
the capacitor's rated voltage.
2. Even if the applied voltage is lower than the rated value, the reliability of capacitors might be reduced if either a high frequency AC
voltage or a pulse voltage having rapid rise time is present in the circuit.
2. PCB Design
◆Pattern configurations （Design of Land-patterns）
1. When capacitors are mounted on a PCB, the amount of solder used （size of fillet） can directly affect capacitor performance. Therefore,
the following items must be carefully considered in the design of solder land patterns:
（1）The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or
cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder
pads which in turn determines the amount of solder necessary to form the fillets.
Precautions
（2）When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's
soldering point is separated by solder-resist.
◆Pattern configurations （Capacitor layout on panelized [breakaway] PC boards）
1. After capacitors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing
processes （PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered
boards etc.） For this reason, planning pattern configurations and the position of SMD capacitors should be carefully performed to
minimize stress.
◆Pattern configurations （Design of Land-patterns）
1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts. （larger fillets
which extend above the component end terminations） Examples of improper pattern designs are also shown.
（1）Recommended land dimensions for a typical chip capacitor land patterns for PCBs
Land pattern
Recommended land dimensions for reflow-soldering（unit: mm）
Solder-resist
Type
107
1.6
212
2.0
316
3.2
325
3.2
Chip capacitor
L
Size
W
0.8
1.25
1.6
2.5
C
A
B
C
0.8～1.0
0.6～0.8
0.6～0.8
0.8～1.2
0.8～1.2
0.9～1.6
1.8～2.5
1.0～1.5
1.2～2.0
1.8～2.5
1.0～1.5
1.8～3.2
B
A
B
Excess solder can affect the ability of chips to withstand mechanical
stresses. Therefore, please take proper precautions when designing
land-patterns.
Chip capacitor
W
Technical
L
considerations
（2）Examples of good and bad solder application
Item
Not recommended
Lead wire of component
Recommended
Solder-resist
Mixed mounting of SMD and
leaded components
Chassis
Solder-resist
Solder (for grounding)
Component placement close to
the chassis
Electrode pattern
Lead wire of component
Soldering iron
Solder-resist
Hand-soldering of leaded
components near mounted
components
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_MR_prec_e-E02R01
Solder-resist
Horizontal component
placement
◆Pattern configurations （Capacitor layout on panelized [breakaway] PC boards）
1-1. The following is examples of good and bad capacitor layout; SMD capacitors should be located to minimize any possible mechanical
stresses from board warp or deflection.
Items
Not recommended
Recommended
Place the product at a right
angle to the direction of the
anticipated mechanical
stress.
Deflection of board
1-2. To layout the capacitors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary
depending on capacitor layout. The example below shows recommendations for better design.
E
D
Perforation
C
A
B
Slit
Magnitude of stress A＞B＝C＞D＞E
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the capacitors can vary according to the
method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and
perforation. Thus, any ideal SMD capacitor layout must also consider the PCB splitting procedure.
3.Soldering
◆Selection of Flux
1. Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
（1）Flux used should be with less than or equal to 0.1 wt% （equivalent to chlorine） of halogenated content. Flux having strong acidity
content should not be applied.
（2）When soldering capacitors on the board, the amount of flux applied should be controlled at the optimum level.
（3）When using water-soluble flux, special care should be taken to properly clean the boards.
◆Soldering
Precautions
1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions.
Sn-Zn solder paste can affect MLCC reliability performance.
Please contact us prior to usage.
◆Selection of Flux
1-1. When too much halogenated substance （Chlorine, etc.） content is used to activate the flux, or highly acidic flux is used, an excessive
amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the
surface of the capacitors.
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may
detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of capacitors in high
humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The
cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux.
◆Soldering
Technical
1-1. Preheating when soldering
considerations
Heating: Ceramic chip components should be preheated to within 100 to 130℃ of the soldering.
Cooling: The temperature difference between the components and cleaning process should not be greater than 100℃.
Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore,
the soldering process must be conducted with great care so as to prevent malfunction of the components due to excessive thermal
shock.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_MR_prec_e-E02R01
【Recommended conditions for soldering】
【Recommended conditions for Pd Free soldering】
［Reflow soldering］
Temperature profile
300
300
Peak
260℃ Max.
Within 10sec.
Preheating
230℃
Within 10sec.
60sec. 60sec
Min.
Min.
200
100
0
200
Slow
Slow cooling
cooling
100
Heating above
230℃
Preheating150℃
60sec. Min.
40sec. Max.
0
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be reflow soldering for 2 times.
Caution
①The ideal condition is to have solder mass （fillet） controlled to 1/2 to 1/3 of the thickness of the capacitor, as shown below:
1/2T～1/3T
Capacitor
Solder
T
PC board
②Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to recommended
times as possible.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_MR_prec_e-E02R01
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